Thermal Management
Enhanced 2.5D/3D IC Interconnection and Cooling
The skyrocketing data traffic demands
The advent of 5G/6G, AI, xEV, IoT and metaverse has spurred a plethora of new end use applications, leading to an exponential growth in data communication in 3C, namely, data centers (i.e, cloud), base stations (i.e., connectivity) and commercial/edge electronics (i.e., client/edge).
Heat cooling challenge occurs
Data centers is maxing out on how much heat they can dissipate for applications such as servers (note: servers, for instance, drive 40 percent of the power used in data centers), network interface cards (NICs), and fiber-optic transceivers, as well as on the trade-offs between switching speed and power efficiency.
In order to deliver ever-higher performance to process the exponential increase in data traffic, processor chip power at data centers is expected to grow 5 times from 2018 to 2025, reaching 1000W per chip with chips packaged in 2.5D IC, 3D IC and/or chiplets-in-SiP platforms.
- 2.5D IC structure Cooling
- 3D IC Structure to reduce the bandwidth between the memory and processor to have better computing performance
- Specific material of cooling system to solve massive heat cooling
- Variety of cooling systems for costumed products
