Service Features

WHY CHOOSE US

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Excellence Experience of CDMO

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Database Development

Overview

IC–Package Co-Design & Co-Optimization

Where Silicon Meets Packaging Reality
We co-optimize IC design and advanced packaging to ensure manufacturability, yield, and long-term reliability in complex multi-die and vertically integrated systems.

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Advanced SiP & Chiplet Development

From Concept to Production-Ready Integration
We develop advanced SiP and chiplet solutions—from idea conception through development and production—enabling faster adoption of 3D and heterogeneous integration technologies.

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Glue IP & Platform IP Enablement

Connecting Disparate Functions into One System
We create and license glue IP that enables power delivery, memory integration, security, clocking, and high-bandwidth die-to-die communication across heterogeneous and vertically stacked devices.

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Ecosystem Orchestration

Aligning the Right Partners at the Right Time
We identify, evaluate, and align best-of-breed OSATs, substrates, BOM suppliers, and R&D partners to accelerate execution and reduce ecosystem friction.

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Manufacturing Readiness & Quality Planning

Making 3D Integration Manufacturable
We support technology development, production ramp, and Advanced Product Quality Planning (APQP) to ensure complex 3D and heterogeneous systems succeed beyond the lab.

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Transformation & Entry Strategy

Helping New Entrants Win in Semiconductors
We assess readiness, identify gaps, and deliver actionable execution plans for companies entering or repositioning within the semiconductor industry—shortening learning curves and reducing risk.

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