Excellence Experience of CDMO
High customer response rate
Discovering new compounds
Database Development
nD-HI focuses on the most critical technology inflection points shaping competitiveness in the AI and data-centric era. We help clients address fundamental architectural, interconnect, and thermal challenges that determine whether advanced semiconductor products succeed at scale.
Bridging the Chip/Package/System Divides to Enable Novel 3D IC Packaging
Powering Performance While Managing Heat
Redefining the Package as a System Platform
Scaling Bandwidth Beyond Copper Limits
Breaking the Memory and Bandwidth Wall
From Monolithic SoCs to Disaggregated Chiplets